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Winbond and Collaborate on Ultra-Low Power, Intelligent IoT, and Wearables

2021-09-29

Winbond Electronics, a global leader in semiconductor storage solutions, announced today that it will cooperate with Ambiq, a recognized technology leader in the ultra-low power microcontroller (MCU), system-on-chip (SoC), and real-time clock (RTC) fields. The product advantages of Bang HyperRAM and Ambiq Apollo4 are jointly committed to providing ultra-low power system solutions for IoT terminals and wearable devices. Currently, the Hybrid Sleep Mode (HSM) equipped with Ambiq Apollo4 SoC and Winbond 256Mb x8 HyperRAM is in the design process, and mass production is expected in 2022. The power consumption of the hybrid sleep mode is only 50% of the normal standby mode, so this mode can extend the battery life of IoT terminals and wearable devices.
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